Description
DESCRIPTION PELCO® Colloidal Silica Suspensions are ideal for the final polishing of materials for which a high quality, visibly scratch free surface is required. Three new formulations are provided, each with a specific average particle size and with increased alkalinity for an enhanced Chemical-Mechanical Polishing (CMP) effect. PELCO® Colloidal Silica CS1 with an average particle size of 80nm and pH value of 9.9 is ideal for many metallographic final polishing applications. #815-120, #815-120-1 SDS (560KB PDF) PELCO® Colloidal Silica CS2 with an average particle size of 50nm and pH value of 9.9 formulated for fine polishing of semiconductor wafers and devices. #815-130, #815-130-1 SDS (560KB PDF) PELCO® Colloidal Silica CS3 with an average particle size of 35nm and pH value of 10.5 formulated specifically for fine polishing of silicon wafers and devices. #815-140, #815-140-1 SDS (560KB PDF) Product #
Description
Unit 815-120
PELCO® Colloidal Silica Suspension CS1, 0.08µm, 16 oz. (473ml)
each 815-130
PELCO® Colloidal Silica Suspension CS2, 0.05µm, 16 oz. (473ml)
each 815-140
PELCO® Colloidal Silica Suspension CS3, 0.035µm, 16 oz. (473ml)
each 815-120-1
PELCO® Colloidal Silica Suspension CS1, 0.08µm, 1 gallon
each 815-130-1
PELCO® Colloidal Silica Suspension CS2, 0.05µm, 1 gallon
each 815-140-1
PELCO® Colloidal Silica Suspension CS3, 0.035µm, 1 gallon
each
