Description
DESCRIPTION Ultra-Flat 6″ diameter Silicon Wafer for demanding substrate studies. The 6″ ultra-flat silicon wafer is shipped in a 6″ wafer carrier. Also available as 5 x 5mm, 5 x 7mm, 10 x10mm stealth-diced dies in Gel-Pak® boxes. Stealth dicing eliminates edge-chipping and cutting debris associated with saw dicing, providing the cleanest, most uniform product possible. All products are packed in class 10 clean room conditions. Properties for 6″ (150mm) Ultra-Flat Wafer: Orientation:
Type: P / Dopant: Boron
Grade: Prime / CZ Virgin
Resistivity: 1-10 Ohm/cm
Thickness: 650 – 700µm
TTV: ≤1.5µm
Warp: ≤30µm / Bow: ≤30µm
Particles: ≤30@≥0.2µm
Front surface: Polished
Back Surface: Etched
Flat: 1 per SEMI Standard (flat length 57.5 ±2.5mm)
Size: 6″ (150mm) diameter wafer or 5 x 5mm, 5 x 7mm or 10 x 10mm diced chips
Roughness: Typical 2-3 Å (by AFM measurement) 21610-6 – Ø6″ Ultra-Flat Silicon Wafer, Type , each 21610-55 – 5 x 5mm stealth-diced Ultra-Flat Wafer, Type , in a Gel-Pak® box, box/25 21610-57 – 5 x 7mm stealth-diced Ultra-Flat Wafer, Type , in a Gel-Pak® box, box/18 21610-510 – 10 x 10mm stealth-diced Ultra-Flat Wafer, Type , in a Gel-Pak® box, box/6
